Mobile World Congress will show the depth of its success
The Mobile World Congress is expected to show how well TSMC’s EUV-based process is doing at attracting customers.
ULV for the first ever 7nm chip
Cristiano Amon told us not so long ago that Samsung and Qualcomm are now big friends and allies, and confirmed that Samsung will be working with Qualcomm on current and future phones. Now, both companies have announced that Snapdragon 5G chipset will be using Samsung’s 7nm LPP EUV process.
The one after Snapdragon 845
Korean based Etnews has mentioned that Qualcomm 7nm manufacturing has been a big win for TSMC while two other US and China customers chose Samsung’s 7nm. TSMC traditionially have dibs on Nvidia and MediaTek too.
Migration to EUV lithography going well
Globalfoundries has improved its extreme ultraviolet (EUV) mask yield rate to nearly 65 percent and made progress in its movement to EUV lithography.
Could be used by 2018
Extreme-ultraviolet (EUV) lithography is working and could be used in Moore Law saving high-volume chip manufacturing as early as 2018.
Back to advancing every two years
Chipzilla has been explaining how it hopes to claw back the missing six months which it lost in chip development and return to Moore’s Law increases of every two years.
Yeah it is probably Intel
ASML, Europe's largest supplier to computer chip makers, will sell 15 of its extreme ultraviolet (EUV) chip etching systems to a "single U.S. customer" who is probably Intel.
Chipmaking gear maker ASML has told the world that that its customer TSMC has exposed more than 1000 wafers on an NXE:3300B EUV system in a single day.
Otellini’s scaremongering or true threat?
Delays drag on