According to Digitimes, the chip will be built using a 12nm process technology later in October and is part of a cunning plan to maintain the shipment momentum of its mobile chips.
The Helio P70 will be like the previous Helio P60, consisting of four Cortex-A73 cores and four Cortex-A53 cores paired with a Mali-G72 GPU.
The main difference is that the P70 has a discrete NPU (neural processing unit) as compared to a discrete APU (accelerated processing unit) used by the P60.
The P60 is Qualcomm's Snapdragon 660 competition but the P70 is believed to take on Qualcomm's Snapdragon 710.
MediaTek is expected to start volume production of its 7nm ASIC by the end of the year.
This will be built using its silicon-proven 56G PAM4 SerDes IP based on a 7nm FinFET process.
The 7nm ASIC will be under the bonnet of two leading gaming console makers, Digitimes claimed.