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Sony fixes Snapdragon 810 overheating on Xperia Z5 Premium

by on07 September 2015

Teardown reveals dual heatpipe

Qualcomm's Snapdragon 810 SoC will go down in history as a SoC that likes to overheat but it appears that Sony managed to solve that problem with its newest Xperia Z5 Premium and Xperia Z5 smartphones by using a dual heatpipe to cool it down.

According to a teardown done by the Chinese Weibo website, both the Xperia Z5 Premium and the Xperia Z5 actually use a dual heatpipe cooling solution in order to keep the Snapdragon 810 well cooled. Sony also used a lot of thermal paste which should transfer the heat from the Snapdragon 810 SoC to the smartphone chassis.

Earlier heat tests already showed that Xperia Z5 Premium does heat up but not as much as earlier smartphones.

We are yet to see some first reviews of the Xperia Z5 Premium smartphone but for now, it appears that Sony has found a way to keep the Snapdragon 810 SoC well cooled.

Xperia Z5premiumteardown 1

Xperia Z5premiumteardown 2


Last modified on 07 September 2015
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