Samsung has commenced production of the world's first 8Gb DDR4 using the 20nm process.
The new chips are employed on 32GB DDR4 modules designed for enterprise servers. The new 8Gb chips join existing 4Gb DDR3 and 6Gb LPDDR3 chips manufactured using the same cutting-edge process.
"Our new 20 nm 8Gb DDR4 DRAM more than meets the high performance, high density and energy efficiency needs that are driving the proliferation of next-generation enterprise servers," said Jeeho Baek, Vice President of Memory Marketing at Samsung Electronics.
Baek said the new chips will help Samsung provide premium, high-density DRAM products, while handling increasing demand from customers in the global premium enterprise market.
The new chips offer a 29-percent performance boost compared to old DDR3 server modules. The use of new high-density chips allows Samsung to build even bigger server modules using 3D TSV technology and 128GB modules are a possibility.
Efficiency should not be a problem, as the new chips run on just 1.2 volts.