Comes with 0.5μm pixel

Samsung has unveiled its newest 200-megapixel ISOCELL HP3 sensor, which brings the “industry’s smallest pixel” at 0.56 μm, while promising better auto-foucs, and clearer HDR images.

To bring higher capacity SSDs in future

Kioxia has showcased 7-bit HLC NAND at the International Memory Workshop (IMW), which could bring higher-capacity SSDs in the future.

Go the way of USB-C as well

According to the latest report, the new entry-level iPad from Apple could come with the A14 chip, 5G connectivity, as well as finally switch to a USB-C port.

Enovix brings faster charging, higher capacity

Enovix has made a new type of silicon-anode lithium-ion battery that could accelerate the adoption of electric vehicles (EVs), bringing faster charge as well as maintaining its capacity quite well.

Revenue grows by 72 percent in Q1

Marvell is doing quite well, better than other fabless chip designers, reporting a revenue increase of 72 percent in Q1, and making it the fastest-growing one on that list.

$109 billion in 2022 and 2023

According to a fresh report, big chip manufacturers are increasing spending on new fab equipment, reaching a record $109 billion in 2022, a 20 percent increase compared to the previous year.

OEMs get the reference design

Intel released a reference design for the NetSec Accelerator at the RSA Conference, a PCIe card aimed at network security.

Upcoming chips to be faster, cheaper

Intel has revealed some detailsl on how it will make chips faster, less costly, and more reliable.

Four sensors for rear camera with Leica sticker

The latest render shows off what appears to be the design and the rear camera system of the upcoming Xiaomi 12 Ultra flagship smartphone.

A good four-year delay

Microsoft has finally updated its roadmap for Exchange Server and the next version will be coming in 2025, a good four years later than planned.