Arriving on platform 9
TSMC vice chairman and CEO C.C. Wei announced the company's plans for 5 nm are on track, which means High Volume Manufacturing (HVM) on the node is expected to be achieved by 2Q 2020.
35 million ARM vs 1.6 million "other“ wafers
There is one big change that is happening in the manufacturing equipment industry and ARM used its ARMTechCon to educate us about the big change. Drew Henry, SVP of infrastructure at ARM, pointed out in its presentation that ARM silicon wafer production ends up in 35 million wafers.
New packaging for its back end
TSMC is attempting to get approval to build a new advanced packaging Fab in Taiwan.
Doing a lot of work in Quantum Computing
We had a chance to chat with the Tom Sonderman, the president of SkyWater - a new/old US owned and operated semiconductor Fab. These guys can make a lot of interesting IoT, automotive and even quantum processing units and what makes it unique is that it is US owned and operated.
Doing the deals to cut the ribbon
TSMC is close to striking deals with a number of equipment, materials and components companies that will support production at its new 12-inch plant in Nanjing, China.
World's first 10nm SoC uses Samsung’s fabs
Qualcomm and Samsung have announced that the latest Snapdragon 835 is using Samsung’s 10nm process technology. One thing is clear the 2017 Snapdragon is now officially the Snapdragon 835.
Foundries are asking LCD driver clients to upgrade to 12-inch process to provide a stable supply for analogue ICs, fingerprint sensors, MCUs, mixed-signal ICs, car-use chips, MEMS and other niche-market products.
Begun the price wars have
It is starting to look like a price war is brewing at the higher end of chip production, with Samsung already negotiating price cuts.