Computex 2019: 7nm Zen 2, 15 percent IPC, PCIe 4.0, and five SKUs
At its Computex 2019 keynote, AMD has unveiled the new 3rd generation Ryzen desktop CPUs based on the 7nm manufacturing process and the new Zen 2 architecture, promising up to 15 percent IPC increase over first-generation Zen architecture and coming on July 7th, with five SKUs for starters.
A 16-core chip running at 4.2GHz Boost clock
An engineering sample of AMD's Zen 2-based 3rd generation Ryzen CPU has been spotted online, showing a 16-core chip with 3.3GHz base and 4.2GHz Boost clocks, and running on AM4 X570 motherboard.
Possible 16-core SKUs
Although AMD only previewed an 8-core/16-thread engineering sample of 3rd generation Ryzen CPU at the CES 2019 keynote, the delidded CPU showcased at the keynote, as well as comments from Dr. Lisa Su, AMD CEO, suggest that we could see SKUs with two chiplets, so 16-core/32-thread SKUs are possible.