Samsung was showing off its 16Gb DDR5 DRAM chips and said that they’ve already been evaluated for compatibility with AMD’s Zen processors.
The new chips are more power efficient and offer 23 per cent higher performance than previous-generation DRAM chips. Apparently, the technological leap was made possible by using high-κ material that increases cell capacitance. Samsung also used its secret sauce to improve critical circuits.
According to the press release the company’s new DDR5 DRAM chips use multi-layer lithography to provide "the industry’s highest die density" and offer a 20 per cent higher wafer productivity. These chips are capable of a data transmission speed of up to 7.2Gbps, which is equivalent to processing two 30GB 4K movies in a second which seems to us an odd unit of measurement.
Samsung will start the mass production of its 12nm-class DDR5 DRAM chips in early 2023 and they will appear in the shops in the fourth quarter of 2023.
Jooyoung Lee, Executive VP of DRAM Product & Technology at Samsung Electronics, said, “Our 12nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM. With exceptional performance and power efficiency, we expect our new DRAM to serve as the foundation for more sustainable operations in areas such as next-generation computing, data centers and AI-driven systems.“