A  report coming from Digitimes.com suggests that Intel could be gearing up to launch its new Kaby Lake-X and Skylake-X HEDT platform with new X299 chipset in the third quarter of 2017, with a possible launch at Gamescom 2017 show in August. As rumored earlier, both Kaby Lake-X and Skylake-X CPUs should launch at the same time and support Intel's new X299 LGA2066 socket chipset and have DDR4-2400(2600) memory support.

The Kaby Lake-X lineup will be coming in a quad-core configuration, with 8MB of cache, 112W TDP and 16 PCIe lanes while the Skylake-X will be offered in 6-, 8- and 10-core SKUs, with 13.75MB of cache, 44/28 PCIe 3.0 lanes and 140W TDP.

Earlier reports suggest that the upcoming X299 chipset platform with LGA2066 socket could probably last for at least three generation of CPUs, including Skylake, Kaby Lake and Cannonlake CPUs. The same reports also suggested that it will bring quad-channel memory support on Skylake-X and dual-channel memory support for Kaby Lake-X CPUs as well as offer 24 PCIe gen 3.0 lanes, 10 USB 3.0, 8 USB 2.0 and Intel-based Ethernet.

In any case, more information will probably be available after the CES 2017 show and as we draw closer to the rumored Q3 2017 launch date.