Published in PC Hardware

TSMC readies MediaTek's 10nm SoC

by on09 August 2016


Helio, is it me you are looking for?

TSMC is gearing up to build MediaTek's new Helio X30 SoC using the 10nm process and it looks like everything will be set for volume production in the first quarter of 2017.

It looks like the chip will be out before TSMC uses the same process to make Apple's new chips later in 2017. Of course when Apple releases its chip it will try to convince the world that it is the first and it invented the whole process.

TSMC will also offer its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology for Apple's 10nm A11 chips.. However this timetable it means that hte X30 will really be the ground breaking technology which tests TSMC's 10nm and MediaTek is taking the biggest risk.

Digitimes said that Qualcomm worked with Samsung Electronics to produce its next-generation Snapdragon 830 chips using its 10nm technology and that TSMC lost the orders for Qualcomm's Snapdragon 820 series to Samsung.

TSMC told its July investors meeting that its 10nm process will start generating revenues in the first quarter of 2017. The node has received product tape-outs from three clients, and more tape-outs are expected to come later in 2016, the foundry said.

Last modified on 09 August 2016
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