The Helio M70 is among the industry's first wave of 5G multi-mode integrated baseband chipsets.
It is a multimode chipset with 2G/3G/4G/5G-enabled support. It supports 5G radio (NR), along with the standalone (SA) and non-standalone (NSA) network architectures, the sub-6GHz frequency band, high power user equipment (HPUE), and other key 5G technologies.
According to MediaTek, it follows the 3GPP Rel-15 new specifications with a 5 Gbps data rate, leading the industry to support carrier aggregation.
It supports LTE and 5G dual connectivity (EN-DC) and ensures mobile devices are backward compatible with 4G/3G/2G when there are no 5G networks.
This simplifies the design of 5G devices which enables device makers to design mobile devices with a smaller form factor, improved energy-efficiency and competitive appearance, MediaTek said.
The outfit has been working with China Mobile in 5G development, MediaTek supports not only 5G standards development and testing, but also in building an industry ecosystem, helping global operators achieve their 5G network roadmap goals in 2019.
TL Lee, general manager of MediaTek Wireless Communications Division said that MediaTek was committed to promoting the adoption of the latest technologies.
“With the commercialisation of the first 5G baseband chipset, Helio M70, consumers will be able to enjoy the exciting 5G experience from a mature and complete solution", he said.
In the future, 5G and AI application areas will continue to grow, enhancing the connected experience for users in areas such as mobile phones or smart living, he added.
The MediaTek Helio M70 baseband chipset is available now, and is expected to ship in the second half of 2019.