Published in PC Hardware

Intel Technology Day - all announcements made

by on13 August 2020

SuperFin 10nm, high-end Xe graphics, new Core, Tiger lake, and more.

Technology Day online can work, and it did work well for Intel. Intel engineering team lead by Chief Architect Raja Koduri and Intel fellows have shown us an incredible amount of news wrapped around six pillars of technology innovation.

SuperFin 10nm

To briefly describe some of them before we get to the details. Raja announced that the second generation 10 nm is called SuperFin and claims the largest single intronod enhancement in history comparable with full nod transition.

In other words, intel's 10nm SuperFin is closer to TSMC's 5nm then it is to 7nm.

Tiger Lake

Tiger Lake is based on SuperFin 10nm, and it is shipping to customers now and can be expected for the holiday season. It has 96EU GPU with much higher performance and the Willow Cove core, new CPU cores that promised a more than a generation increase in CPU performance with a significant frequency increase. It even supports LP5 5400 RAM for future designs and DDR4 and LP4X for this year's designs. More about the performance in early September.

Intel packaging came up with the Hyper bonding test chip

It taped out in Q2 2020, and it is an alternative to traditional thermocompression. The new technology will bump pitch to 10nm and below.

Hybrid Architecture

Intel announces Alder lake without mentioning Rocket Lake S. Alder lake is confirmed to have hybrid architecture using both Golden Cove and Gracemont (next-gen 2021 Atom) cores optimized for great performance per watt.


Intel detailed Xe LP (Low Power) graphics that will be the part of Tiger Lake with 96 EUs and significant performance achieved by a brand new design.

Intel Xe HP

The Xe HP is a data center product aiming to satisfy streaming needs, and it was demonstrated to handle ten 4K 60 FPS videos. It will be available next year. It comes as one, two, and four tile part for rack level media performance.


Xe High-performance gaming is the external manufactured high-end GPU solution that will ship in 2021. It is manufactured externally, supports Ray Tracing, and should be comparable with the other two big players in performance per watt metrics. It is a GDDR6 and based on building brocks from Xe LP.

Intel server SG1

It is Xe for the data center. SG1 has the performance of four GD1 in a small footprint for the data center targeting low latency, high-density android cloud gaming, and video streaming for the data center form factor. SG1 will ship later this year.

Intel DG1

Intel DG1 will start shipping in 2020, and it is now available for the developers. Intel command center supports instant game tuning and game sharpening.

Data Center

Ice Lake 10nm Xeon is targeted for later part of 2020. It will offer significant performance in throughput and responsiveness across workloads. Ice Lake supports total memory encryption, PCIe 4.0, eight memory channels with instruction set architecture to speed up crypto processing. There will be IoT and Network variant of the Ice Lake server, more later this year.

Sapphire Rapids is intel's next-generation Xeon scalable based on 10nm SuperFin transistors. It supports DDR5, PCIe 5.0, compute express link 1.1. It is the CPU of the Aurora Exascale supercomputer system at Argonne National Lab. It is expected in the second half of 2021.

Intel demonstrated the first-gen 224G PAM 4 TX transceiver, twice as fast as the previous generation.  


 OneAPI Gold is expected later this year, providing developers with production quality and performance across scalar, vector, matrix, and spatial architecture.

There will be a more detailed part, but this has summarised what we have been listening for around six hours at first and, hopefully once, Intel online technology days.


Last modified on 13 August 2020
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