Today we had a chance to visit Globalfoundries Fab 1 in Dresden, Germany and we saw 32nm 300mm wafers in a test production run of some core logic as well as some memory.

The process won't be ready for customers before mid 2010, but since AMD is the only one that will be needing 32nm silicon on insulator, the schedule is ahead of time, as AMD won't have any 32nm products before 2011.

This schedule is part of AMDs design process and has nothing to do with the Fab, but it is too early to talk about the state of the process and yields. The 32nm transition will be a tough one. Despite the fact that transistors and transistor pitch are getting smaller, AMD also needs to implement high metal gate, and as far as we understood, this is not a walk in the park.


Nick Ernst from Golem.de


Scott Bicheno from Hexus, Fudo in the middle and Jason Gorss PR manager of Globalfoundries.


Jon Carvill Director of Globalfoundries, Fudo, Scott Bicheno and Paul Dutton of Hexus