According to Intel, Fab 9 is quite important for Intel's future and the next era of Intel's innovation in advanced packaging technologies, as the company likes to call it. These advanced packaging technologies such as Foveros and EMIB (embedded multi-die interconnect bridge), according to Intel, offer a faster and more cost-efficient path toward achieving 1 trillion transistors on a chip and extending Moore’s Law beyond 2030.

In case you missed it, Intel Foveros stacks compute tiles vertically, rather than side-by-side, allowing Intel and its customers to mix and match various compute tiles to optimize cost and power efficiency.

“Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation,” said Keyvan Esfarjani, Intel executive vice president and chief global operations officer.

The $3.5 billion investment in Intel's Rio Ranco, New Mexico facilities has created hundreds of jobs across the state, and it does not come as a big surprise since Intel has been there since 1980.