Apple unveils new A18 and A18 Pro SoCs
3nm and 16-core NPU for 35 TOPs
Apple has officially announced its two new chipsets, the A18 and the A18 Pro, with the new iPhone 16 and iPhone 16 Plus getting the A18 and the iPhone 16 Pro and iPhone 16 Pro Max getting the more powerful A18 Pro SoC.
Intel details its Lunar Lake architecture with impressive improvements
Foveros packaging at its best with new P- and E-cores, Intel Thread Director, new NPU, and Arc Xe2 GPU
Intel has shed more details about its Lunar Lake architecture during the Tech Tour event, including details about all the improvements it will bring to the new Core Ultra mobile processors. This is an extensive list that includes new Lion Cove P-cores, Skymont E-cores, new NPU, the Arc Xe2 Battlemage GPU, and enhancements to the Intel Thread Director, all neatly packaged into a single-tiled SoC.
Intel Lunar Lake as 16GB or 32GB
Hardwired into the SoC
Starting with its upcoming Lunar Lake laptop CPU series, Intel will install memory into the processor SoC itself, offering only 16GB or 32GB initially. This will mean the end of user-replaceable RAM, at least for this series of chips.
Nvidia and Mediatek allegedly working on new SoC for consoles
Want a piece of that market
Nvidia and Mediatek are allegedly working on a brand new SoC for handheld and other gaming consoles, and have quite a few clients already lined up. Nvidia is no stranger to such SoCs, and it has recently teamed up with Mediatek for mobile chips that could use next-gen RTX and AI GPU IP based on the upcoming Blackwell architecture.
MediaTek announces 4nm Dimensity 8300 SoC
Significantly faster thanks to Armv9 CPU cores and Mali-G615 GPU
MediaTek has announced its newest Dimensity 8000-series SoC, the Dimensity 8300. The new SoC is both faster and much more efficient thanks to the fact it is manufactured on TMSC's 4nm manufacturing process and comes with Armv9 CPU cores and the new Mali-G615 GPU.
Mediatek announces its flagship 4nm+ Dimensity 9300 SoC
Octa-core CPU with Cortex-X4 and Cortex-A720 cores and ray tracing-capable GPU
Mediatek has officially announced its flagship Dimensity 9300 SoC which should be coming to phones pretty soon, at least in China. This 4nm+ SoC brings an "all big CPU design", combining four Cortex-X4 and four Cortex-A720 cores and a 12-core Immortalis-G720 GPU with hardware ray tracing. Mediatek promises impressive performance gains across the board, including CPU, GPU, and AI with the new 7th gen APU.
Qualcomm announces its new Snapdragon 8 Gen 3 flagship SoC
Octa-core CPU with single Cortex-X4 Prime Core and Adreno GPU with Ray Tracing
Qualcomm has officially announced its latest flagship SoC, the Snapdragon 8 Gen 3, promising better performance and higher power efficiency all across the board, and plenty of other improvements.
Samsung gives out some Exynos 2400 details
Claims 70 percent faster CPU and Xclipse 940 GPU with AMD RDNA 3
During its own LSI Tech Day 2023 event, Samsung revealed details about its upcoming Exynos 2400 SoC that will most likely power the next Galaxy S24 series smartphones, promising impressive performance figures and confirming AMD RDNA 3 architecture for the Xclipse 940 GPU.
Xiaomi Mix Fold 3 officially launches with Qualcomm SD 8 Gen 2 SoC
Thinner, new hinge, better screens, quad camera system, and more
After all the teasers and leaks, Xiaomi has officially announced its new Mix Fold 3 smartphone, refining the design, and equipping it with better screens, a quad-camera system, and Qualcomm's Snapdragon 8 Gen 2 SoC.
Qualcomm unveils Snapdragon 4 Gen 2 SoC
4nm SoC with support for LPDDR5 3,200 memory and UFS 3.1 storage
Qualcomm has unveiled its latest Snapdragon 4 Gen 2 SoC for entry-level smartphones. This one is manufactured on a 4nm manufacturing process and brings the same core configuration as its predecessor but with some improvements, including LPDDR5 memory and UFS 3.1 storage support.