While most people, including Intel, appear to have forgotten Moore's Law, that claimed the number of transistors that can fit on a processor will double roughly every two years, Gelsinger wants to make it clear he has not.

Gelsinger said Moore’s Law was alive and well and Intel will maintain or even go faster than Moore’s Law for the next decade.

“We are entering a period of sustained if not ‘super’ Moore’s Law. We expect to even bend the curve faster than a doubling every two years. And we will not rest until the periodic table is exhausted. We as the stewards of Moore’s Law will be relentless in our path to innovate in the magic of silicon.”

Gelsinger said new advances in transistor manufacturing have the potential to break the transistor logjam and even accelerate the pace of transistor increases. While the semiconductor industry is moving to adopt new Extreme Ultraviolet (EUV) lithography that will allow for more transistors to be etched into a silicon chip, Intel is going a step further to adopt High-NA EUV, which is a more advanced lithography technique.

Intel's Foveros Omni model allows for vertical chip expansion, which will give more space for transistors in the same horizontal space as current chips, he said.

If Gelsinger is correct, combined with next-next-gen EUV silicon lithography, Intel could pull ahead even further. And since Intel relies almost exclusively on its own fabrication process, its innovations are more likely to be kept in-house, giving Intel a definite advantage over AMD and Apple, both of whom rely on semiconductor fabricator TSMC.

He said Intel is going to be comfortably ahead of anybody else in the industry." I expect as we look at those coming together, you know, we’re just going to be adding advantage [with its IDM 2.0 manufacturing strategy], as we look out over the rest of the decade.”