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USB 3.0 to show its potential at IDF

by on18 September 2009


Notebooks, motherboard and video camera
Intel Developer Forum, or most commonly referred to as IDF, is planned for next week and it's the right place to check out some USB 3.0 action. In addition to improved power efficiency, the next-gen USB 3.0 is also going to bring up to 10 times faster transfer speeds. 

According to CNET, punters who attend the two USB 3.0 technical sessions scheduled during IDF will be able to see a Fujitsu notebook with an NEC Electronics host controller chip that will work together with external SuperSpeed USB drive from Buffalo Technology. Asus will also have its few minutes of glory with its X58 motherboard that features the same NEC chip. 

In addition to the previously mentioned devices, Point Grey Research will show a high-end video camera that uses Sony's 3MP IMX036 CMOS sensor, giving 1080p video at 60FPS, in order to stream uncompressed HD video to notebook via SuperSpeed USB ExpressCard from Fresco Logic. 

Intel, HP, Microsoft, NEC, ST-Ericsson and Texas Instruments are the guys behind this new USB 3.0 specification while the first consumer devices with USB 3.0 are expected to hit the market sometime early next year, or in best case scenario at the end of this year. 

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Last modified on 18 September 2009
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