Featured Articles

LG G Watch R ships in two weeks

LG G Watch R ships in two weeks

The LG G Watch R, the first Android Wear watch with a truly round face, is coming soon and judging by…

More...
LG unveils NUCLUN big.LITTLE SoC

LG unveils NUCLUN big.LITTLE SoC

LG has officially announced its first smartphone SoC, the NUCLUN, formerly known as the Odin.

More...
Microsoft moves 2.4 million Xbox Ones

Microsoft moves 2.4 million Xbox Ones

Microsoft has announced that it move 2.4 million consoles in fiscal year 2015 Q1. The announcement came with the latest financial…

More...
Gainward GTX 970 Phantom previewed

Gainward GTX 970 Phantom previewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
EVGA GTX 970 SC ACX 2.0 reviewed

EVGA GTX 970 SC ACX 2.0 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Monday, 28 July 2014 17:15

Intel Haswell-E Core i7-5960X de-lidded

Written by Slobodan Simic

 corei7extn logo

Uses soldered thermal interface material

Overclockers and enthusiasts can rejoy as the newest picture of a de-lidded Intel Core i7-5960X Haswell-E CPU shows that Intel is using soldered thermal interface material (TIM) for its upcoming line of High-End Desktop (HEDT) Haswell-E CPUs.

Guys from the OCDrift.com managed to get their hands on a picture of a de-lidded the flagship Haswell-E CPU, the Core i7-5960X, which shows that Intel has decided to solder the die of the chip to the IHS with a strong epoxy. This is good news for enthusiasts and overclockers, as the soldered IHS will allow much better heat conductivity, something that was a big problem on Intel's previously available Core i7-4790K, Core i7-4770K and the Core i7-3770K CPUs.

Intel-Corei75960Xdelidded 1

In case you missed the previous reports, Intel plans to release its new HEDT platform, which includes Haswell-E CPUs as well as the new X99 Express chipset sometime in September. The Haswell-E lineup will include three SKUs, the Intel Core i7-5820K, Core i7-5930L and the flagship Core i7-5960X. Earlier rumors suggest that the Core i7-5960X is an octa-core part with Hyper-threading support, 20MB of L3 cache, 3.0GHz base and 3.3GHz Turbo clocks and a 140W TDP.

The accompanied X99 Express HEDT platform chipset will bring several new features but the main advantage is the support for DDR4 memory, with DDR4 memory controller integrated within the CPU itself. Just as it was the case with the Ivy Bridge-E, the new Haswell-E HEDT platform will offer better overclocking features. The flagship Core i7-5960X Haswell-E CPU is expected to have the same US $999 price tag as all previous Extreme Edition CPUs.

 

Last modified on Tuesday, 29 July 2014 07:42
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments