Featured Articles

AMD sheds light on stacked DRAM APUs

AMD sheds light on stacked DRAM APUs

AMD is fast tracking stacked DRAM deployment and a new presentation leaked by the company  points to APUs with stacked DRAM,…

More...
Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 18 December 2013 08:07

AMD teams up with SK Hynix for 3D memory

Written by Fudzilla staff



Stacked with love

AMD and SK Hynix have announced that they will jointly develop high-bandwidth 3D stacked memory technologies and products.

AMD is pinning its hopes on APUs, which are a good way of using silicon efficiently and using the same package for the GPU and CPU. However, APUs require a lot of bandwidth, i.e. even cheap APUs benefit from somewhat faster memory modules, and let’s not forget about GDDR5 rumours, which did not pan out with Kaveri.

3D stacked memory should be used as high-bandwidth memory (HBM) that’s smaller yet faster than GDDR5. It can be used as system RAM or graphics memory. HBM was developed mainly for graphics applications and it should enter mass production in 2015. Built using new Wide I/O and TSV technologies, it should support bandwidths from 128GB/s to 256GB/s.

Such bandwidth makes a lot more sense when it comes to GPUs, at least at this point. Both Nvidia and AMD are expected to use stacked memory in their 20nm products, but probably not in first-generation 20nm products.

It remains unclear when AMD will embrace the technology for APUs. This would be somewhat more complicated, at least in consumer products that have to rely on off the shelf technology and components, which makes deployment of new technologies much slower.

blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments