Featured Articles

Gainward GTX 970 Phantom previewed

Gainward GTX 970 Phantom previewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
Snapdragon 400 is Qualcomm’s SoC for watches, wearables

Snapdragon 400 is Qualcomm’s SoC for watches, wearables

We wanted to learn a bit more about Qualcomm's plans for wearables and it turns out that the company believes its…

More...
Qualcomm sampling 20nm Snapdragon 810

Qualcomm sampling 20nm Snapdragon 810

We had a chance to talk to Michelle Leyden-Li, Senior Director of Marketing, QCT at Qualcomm and get an update on…

More...
EVGA GTX 970 SC ACX 2.0 reviewed

EVGA GTX 970 SC ACX 2.0 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
Nvidia GTX 980 reviewed

Nvidia GTX 980 reviewed

Nvidia has released two new graphics cards based on its latest Maxwell GPU architecture. The Geforce GTX 970 and Geforce GTX…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Wednesday, 18 January 2012 15:14

Cooler Master announces Vertical Vapor Chamber tech

Written by Slobodan Simic

cm logo_mala

The future of air CPU coolers


During CES 2012, and now officially, Cooler Master showed off its Vertical Vapor Chamber technology that will be featured in upcoming CPU heatsinks. The new tech simply places two vapor chambers between the heatsink that improves heat transfer due to the larger contact area of vapor chamber thus enabling higher cooling performance at pretty much same or even lower noise level when compared to now already standard heatpipe coolers.

According to Cooler Master, the Vertical Vapor Chamber features less than half the air resistance by reducing airflow vortexes and noise generated by air straming through a heatsink. Thanks to the 3 time the fin contact area, you get faster and more efficient transfer of heat from the vapor chambers to the fins and more efficient use of the available fin surface area.

Cooler Master has noted that thanks to the Vertical Vapor Chamber, the new coolers should be able to deal with CPUs in excess of 200W with the same or lower noise level when compared to traditional coolers. The first product that will feature Vertical Vapor Chamber tech is the TPC-812 that should be officially released sometime around CeBIT where we will certainly get more details.

cm vvc_1

Last modified on Wednesday, 18 January 2012 19:52

Slobodan Simic

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments