Taiwan outfit Xilinx has released what it claims is the industry's first stacked silicon interconnect technology.
The outfit said that by using a multiple FPGA die the gear can deliver higher capacity, bandwidth and power savings in a single package. It uses 3D packaging technologies and through-silicon vias (TSV) for its 28nm 7 series FPGAs.
Xilinx's Targeted Design Platforms claims to be able to handle systems with resource requirements that are more than double the reach of the largest single-die FPGAs. This enables Xilinx to overcome the boundaries of Moore's Law and offer
electronics manufacturers unparalleled power, the outfit thinks.
Xilinx Senior Vice PresidentVincent Tong said that one of the ways the 28nm Xilinx 7 series FPGAs extend the range of applications programmable logic can address is by offering capacity of up to 2 million logic cells.
“Our stacked silicon interconnect packaging approach makes this remarkable achievement possible," he said.