Globalfoundries VP of marketing Jim Ballingall announced today that Globalfoundries is a $4 billion revenue company, and that the company plans to double its capacity in the next two years.
This is not all as they plan to triple in next four years. Currently the Dresden fab is Globalfoundries’ biggest operational fab with the most advanced technology. These guys are making 45nm chips and soon they will start churning out 32nm chips as well.
They will be able to produce 80,000 wafers a month as the new part of the fab comes online. The Singapore fab is producing 21,000 wafers and they can ramp up to 50,000 wafers mostly in 65nm which is important for wireless, car and other industries that don’t need the leading edge. The company’s upcoming New York fab should start making chips in 2012 and the new fab should be able to produce 60,000 wafers in 28nm or below.
The plan is to more than double 300mm capacity in the next two years and most likely to make a lot of money in the foundry market over the same period.
GTC 2010: Big plans, big promises
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Fuad Abazovic
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