Featured Articles

Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

More...
Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

More...
TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

More...
Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Monday, 30 November 2009 13:43

Geneva 2010 AMD mobile dual has 15W TDP

Written by Fuad Abazovic

Image

Q2 2010


After AMD's
recently launched Congo platform comes Nile, which is scheduled for launch in 2010. Congo codename got replaced to 2nd generation Ultrathin as some people were against the name because of a massive genocidal campaign in Congo, which claimed the lives of around 5 million people in the past decade. We can assure you that AMD was just thinking about cool codenames for its chips and didn’t have time to bother with politics.

Anyway, Congo is powered by Conesus dual and single Core CPUs and Nile will be powered with Geneva dual and single-core CPUs. Geneva looks quite nice, it is still based on K10.5 45nm core but it has two cores 2MB of L2 cache, finally a DDR3 800 support and new ASB2 package.

The top mainstream Geneva has a 15W TDP, three down from 18W with mainstream Conesus. The essential version Geneva has a 12W TDP, some 30 percent down from 18W on Conesus essential series CPUs. Value single-core Geneva has 1MB of L2 cache, DDR3 800 support and a 12W TDP, three down from a value single core Conesus.

We expect them in Q2 2010.  

Last modified on Monday, 30 November 2009 14:01
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments