TSMC gets fan-out (InFO) wafer-level packaging
Published in Processors


All ready for 2016

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.

TSMC wants 12 inch wafer factory in China
Published in Processors
Monday, 07 December 2015 10:47

TSMC wants 12 inch wafer factory in China


16nm plans

TSMC has asked the Investment Commission of Taiwan's Ministry of Economic Affairs to allow it to invest in a wholly-owned 12-inch wafer manufacturing facility and a design service centre in Nanjing, China.

Chinese foundries developing FinFET rival
Published in Processors
Friday, 30 October 2015 10:14

Chinese foundries developing FinFET rival


Slimming down with Ultra-Thin Body processes

Chinese foundries are ignoring FinFET technology and are developing Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production.

UMC expects wafer shipments fall
Published in News
Thursday, 30 July 2015 13:35

UMC expects wafer shipments fall


Predicted slump

United Microelectronics (UMC) expects to post an up to 5 per cent decrease in wafer shipments for the third quarter of 2015. 

Monday, 06 August 2012 12:21

TSMC to invest $1.4 billion in ASML

tsmc logo

Lithography systems maker to advance chip making by two years

Wednesday, 05 January 2011 10:04

More than 15 wafer fabs shut

y_wafer

Absolutely fabless
Thursday, 02 September 2010 09:49

Llano wafer pictured

fusion

GTC 2010: Quad-core Fusion closer than ever