Begun the Gen.3.14 FinFet wars have
Samsung and TSMC are starting to slug it out introducing Gen.3 14 and 16-nano FinFET system semiconductor processes, but the cost could mean that smartphone makers shy away from the technology in the short term.
Two years after 7nm
Foundry TSMC claims it will be ready to roll out its 5nm process technology two years after the launch of its 7nm node..
Will out perform the industry average
While many expected TSMC to suffer from from the downturn in China it appears that the company is still doing rather nicely thank-you.
Qualcomm knifes TSMC
Qualcomm's long running partnership with TSMC appears to be grinding to a halt after the chipmaker chose rival Samsung to make its coming flagship mobile chip.
Expansion in the works
TSMC appears to be planning another huge chip exansion and written cheques to the value of $700 million on semiconductor capital equipment in recent weeks.
All ready for 2016
TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.
TSMC has asked the Investment Commission of Taiwan's Ministry of Economic Affairs to allow it to invest in a wholly-owned 12-inch wafer manufacturing facility and a design service centre in Nanjing, China.
Low production capacity
The dark satanic rumour mill has manufactured a hell on earth yarn that Intel will not be getting the work for LG’s Nuclun 2 because it lacks the production capacity.
Predicts it can make its cash elsewhere
Intel said 2016 sales will climb in the "mid single-digit" percent range and said it didn’t need a buoyant personal-computer market to make piles of dosh.