Automotive on the cusp of change
Intel CEO Brian Krzanich told the assorted throngs at the LA Auto Show's AutoMobility conference that Chipzilla will invest $250 million over the next two years to make fully autonomous driving a reality.
ROCm writes and compile parallel programs
AMD has released the latest version of its ROCm software tools which make it easier to write and compile parallel programs for its new Zen GPUs and CPUs.
One of the things that we are noticing is that all the leaks and other information coming out of Chipzilla, suggests that the outfit is getting excited about the overclocking market.
The Basin Falls platform with Skylake-X and Kaby Lake-X
The newest leaked documents reveal a few more details about Intel's next high-end desktop (HEDT) platform that will include both Kaby Lake-X and Skylake-X CPUs and be a part of the Basin Falls X-series platform.
AMD placing USB 3.1 chipset orders as well
According to sources from motherboard makers, Intel is planning to add USB 3.1 and Wi-Fi functionality to its upcoming 300-series motherboard series scheduled to be released at the end of 2017.
Fruity cargo-cult Apple has put the brakes on the next instalment for the iMac PC line-up because it wants to install Intel’s new Kaby Lake.
And poaches Intel man
Taiwanese fab company TSMC has approved a capital injection of $4.91 billion at a board meeting.
Laser chips could be the next big thing
Analyst outfit Susquehanna Financial Group gave Intel the thumbs up for its newly developed "laser chips" saying the development could be a game changer that will give the company the data centre chip market for years.
Based on TLC 3D NAND
According to the latest leaked slide, Intel is working on the new performance-segment 610P series SSD based on TLC 3D NAND, M.2 2280 form-factor and PCIe NVMe interface.