Qualcomm leads mobile industry to 10nm
Published in Mobiles
Sunday, 20 November 2016 14:08

Qualcomm leads mobile industry to 10nm


CPUs and GPUs are on 14/16 nm

Keith Kressin, a Qualcomm senior vice president, product management, reminded us how the world changed in the last ten years and that the mobile industry leads the transition to smaller manufacturing nodess. With Snapdragon 835 being the first 10nm, the mobile SoC with Qualcomm on helm takes the lead beating CPU and GPU industry to a new manufacturing node.

Snapdragon 835 is a 10nm slap in Intel’s face
Published in Mobiles
Thursday, 17 November 2016 15:27

Snapdragon 835 is a 10nm slap in Intel’s face


World’s first 10nm SoC is a big deal

Kaby Lake, the third generation 14nm was launched in 2016 and it looks like Cannon Lake 10nm Intel CPU might only launch in late 2017. But it is fairly certain that the Snapdragon 835 mobile SoC is going to ship in the first half of 2017.

Intel invests $250 million in self-driving cars
Published in News
Thursday, 17 November 2016 12:04

Intel invests $250 million in self-driving cars


Automotive on the cusp of change


Intel CEO Brian Krzanich told the assorted throngs at the LA Auto Show's AutoMobility conference that Chipzilla will invest $250 million over the next two years to make fully autonomous driving a reality.

AMD readies Zen’s server software
Published in Processors
Tuesday, 15 November 2016 14:26

AMD readies Zen’s server software


ROCm writes and compile parallel programs

AMD has released the latest version of its ROCm software tools which make it easier to write and compile parallel programs for its new Zen GPUs and CPUs.

Intel seems to be going for overclockers
Published in Processors
Monday, 14 November 2016 11:44

Intel seems to be going for overclockers


Hardly mainstream


One of the things that we are noticing is that all the leaks and other information coming out of Chipzilla, suggests that the outfit is getting excited about the overclocking market.

Intel HEDT Skylake-X desktop platform detailed
Published in Processors


The Basin Falls platform with Skylake-X and Kaby Lake-X

The newest leaked documents reveal a few more details about Intel's next high-end desktop (HEDT) platform that will include both Kaby Lake-X and Skylake-X CPUs and be a part of the Basin Falls X-series platform.

Intel to add Wi-Fi and USB 3.1 functionality in 300-series
Published in Motherboards


AMD placing USB 3.1 chipset orders as well


According to sources from motherboard makers, Intel is planning to add USB 3.1 and Wi-Fi functionality to its upcoming 300-series motherboard series scheduled to be released at the end of 2017.

Apple fans told to wait for new iMac
Published in News
Thursday, 10 November 2016 14:32

Apple fans told to wait for new iMac



Intel’s fault


Fruity cargo-cult Apple has put the brakes on the next instalment for the iMac PC line-up because it wants to install Intel’s new Kaby Lake.

TSMC plunges billions into fab upgrades
Published in News
Wednesday, 09 November 2016 16:42

TSMC plunges billions into fab upgrades


And poaches Intel man

Taiwanese fab company TSMC has approved a capital injection of $4.91 billion at a board meeting.

Intel’s use of lasers could change chips
Published in News
Tuesday, 08 November 2016 14:57

Intel’s use of lasers could change chips


Laser chips could be the next big thing

Analyst outfit Susquehanna Financial Group gave Intel the thumbs up for its newly developed "laser chips" saying the development could be a game changer that will give the company the data centre chip market for years.