Slimming down with Ultra-Thin Body processes
Chinese foundries are ignoring FinFET technology and are developing Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production.
Six percent growth in a flat market
The overall semiconductor market is going to be flat or slightly down this year, but the foundry market is forecast to grow 6.1 per cent.
FinFETs and SOI working in different environments
Soitec's CEO and board chairman has raised an eyebrow or two when he said that the iPhone 6s has multiple RF chips built on silicon-on-insulator (SOI) substrates and that Intel and IBM are using the tech for their silicon photonics push.
More rumours – this time from the Orient
We wrote a story a while back claiming that GloFlo was going to develop its own 7nm 10nm free from the licencing constraints of its partner Samsung. This was greeted by much mirth at the time, but it is looking like we were right.
Jon Carvill is now VP of communications
A rock star PR who worked as a Senior Director of communication at Qualcomm has been poached by the music outfit Vevo.
GlobalFoundaries now a significant force
GlobalFoundries has signed off on the purchase of IBM's chip business making it one of chip industries key players and actually filling its bank acount.
Rumours of knifings
Since AMD canned its Project Skybridge two weeks ago the dark satanic rumour mill has suggested that Globalfoundaries might have had a hand in it.
What is the sound of four cores clapping?
Some of AMD's first Zen based CPUs and APUs will be quad-core.
Licenced by Samsung
Globalfoundries is now getting volume production from the 14nm FinFET technology it licensed from Samsung.