A Belgium guy who runs hardware.fr, Mr Damien Triolet, was one of the first guys who spotted and pictured Pat Gelsinger at IDF Bejing with what seems to be Larrabee wafer. Good job as the picture was not showed at the keynote webcast.
Gelsinger who is a Senior Vice President General Manager, Digital Enterprise Group at Intel was holding a wafer with a lot of Larrabees on it and even the picture has been taken from a far, you can tell that the die is huge. We don’t know what manufacturing process is used for that wafer but the chip looks at least as big as GT200 at 65nm from Nvidia and we can only guess that wafer was 45nm than 32nm. Damian believes we are talking about 600mm2.
Gelsinger, or Kicking Pat how Mike Magee likes to call this chap, also said that Larrabee should come in late 2009 or early 2010 which means that they still don’t have a fixed plan but we will try to find out more about it.
You can check the original version in French here or goggle English here.