News - subcat

Samsung S10, 10+, 5G and fold are a Qualcomm win
Published in Mobiles


855, 5G, ultrasonic sensor

The Galaxy S10 series and the Galaxy Fold are the next chapter in Samsung’s history and the company decided to use multiple Qualcomm products to power the S10, 10+ and the Galaxy S10 5G.

Snapdragon X55 2nd gen 5G modem is out
Published in Mobiles
Tuesday, 19 February 2019 16:01

Snapdragon X55 2nd gen 5G modem is out


7Gbps supports 2G to 5G

2019 is the year of real 5G and companies like Qualcomm are enabling at least 20+ operators, 20 OEM building 5G partners and 30+ commercial 5G products to launch. The X50 was announced in 2016 and shipping to partners for a while and will enable the first wave of 5G devices. Snapdragon X55 is enabling the missing features and complementing the 5G offering.

Snapdragon 855 is the only AP for 5G
Published in Mobiles
Monday, 18 February 2019 11:42

Snapdragon 855 is the only AP for 5G


From the house of Qualcomm

Next week will be a great leap forward in the 5G journey for the whole industry and we just wanted to set one thing straight. It turns out that Snapdragon 855 will be the only application processor SoC from Qualcomm for 5G phones and that 845 remains 4G only.

Radeon VII production cost $650+
Published in Graphics
Monday, 28 January 2019 11:47

Radeon VII production cost $650+


Bill of Materials

Our original article about the HBM 2 cost gained a lot of traction and we decided to try to dig out how much the whole card BOM (bill of materials) might be.

Radeon VII 16GB HBM 2 memory cost around $320
Published in Graphics
Saturday, 26 January 2019 08:55

Radeon VII 16GB HBM 2 memory cost around $320


Close to half of the MSRP

The marketing guys at AMD did a nice job naming the card Radeon VII (Roman 7) as it is a 7nm, launching on February 7 and costing $699 but our investigation shows that 16GB HBM 2 comes at a hefty price.

AMD has no plans to use chiplet design for next-gen APUs
Published in PC Hardware


Will use a different design similar to mobile parts

According to post-CES details showing up online, it appears that AMD will not use the same chiplet design for its next-gen APUs, keeping the chiplet design for its 2nd generation EPYC and 3rd generation Ryzen desktop CPUs.

AMD previews 3rd gen Ryzen at CES 2019
Published in PC Hardware
Wednesday, 09 January 2019 19:33

AMD previews 3rd gen Ryzen at CES 2019


Up and running with Radeon VII

In addition to details regarding 2nd generation EPYC CPUs, AMD's CEO, Dr. Lisa Su, also gave a preview of its third generation Ryzen CPU.

Huawei sold 200 million phones
Published in Mobiles
Thursday, 27 December 2018 12:43

Huawei sold 200 million phones


Went from 103M in three years

Huawei managed to sell 200 million smartphones in 2018 - a massive increase from 103 million in 2015 or just three million in 2010. As of the first half of this year, Huawei is the world’s second biggest smartphone manufacturer overtaking Apple and leaving Samsung in the prime position.

Qualcomm announces Snapdragon 8cX
Published in PC Hardware
Thursday, 06 December 2018 20:55

Qualcomm announces Snapdragon 8cX


Always connected and always on 7nm new SoC

Qualcomm's Sanjey Mehta, SVP and General manager of compute products, and Miguel Nunes, senior director of compute products, introduced and showed off a few features of the Snapdragon 8cx, a SoC that many called Snapdragon 1000 or 8150/8180. This is a SoC built from the ground up with a bigger Adreno 680 GPU, still fanless and with a lot of new tricks.

Snapdragon 855 is a wireless beast
Published in Mobiles
Wednesday, 05 December 2018 21:01

Snapdragon 855 is a wireless beast


WiFi 6, 2Gbps 4G, X50 for 5G

Qualcomm’s Druga Mallardi, an SVP and general manager of 4G and 5G, has announced the wireless building blocks of the Snapdragon 855. It packs 2Gbps Gigabit LTE, 5G, WiFi 6 and 60GHz WiFi.