It is starting to look like TSMC cannot get scanners ready at least a couple of years and the technology will be ready for TSMCs 7nm nm fabrication process.
KitGuru said that EUV scanners have lasers with 13.5nm wavelength that allow to "draw" finer features of chips.
EUV will eliminate need for multi-patterning, will shrink cycle times and will help to improve yields of chips made using leading-edge process technologies.
ASML, a leading maker of semiconductor production equipment, is working closely with TSMC and other leading makers of chips to prepare the new devices. TSMC plans to try EUV with its 7nm fabrication process in 2017–2018 and then use it commercially to make chips using 5nm manufacturing technology.
Co-CEO of TSMC Mark Liu said that EUV is not part of the 7nm development schedule but might be used as a test for the technology, Vurrently we are planning to use EUV at 5nm. But of course it does depend certain development criteria, milestones to be reached."
At present TSMC expects to start volume production of chips using 7nm process technology sometimes in the first half of 2018. Considering how aggressively the company intends to introduce new manufacturing processes going forward, it is possible that it will start trial production using 5nm EUV process technology in 2018 – 2019 timeframe.