Published in Memory

Samsung ePoP memory enters mass production

by on05 February 2015

Reduces footprint, boosts efficiency

Samsung has announced that it is now mass producing Embedded Package on Package (ePoP) memory, which greatly increases density and efficiency.

A single ePoP module includes 3GB of LPDDR3 DRAM and 32GB of eMMC storage, along with a controller. The module is thin (1.4mm) and small, with a significantly smaller PCB footprint than current two-package eMCP memory solutions.

Samsung’s new ePoP takes up 225 square millimetres (15x15mm), just like the mobile application processor. The currently used PoP also measures 15mm x 15mm, but it consists of the mobile processor and DRAM - eMMC is housed in a separate 11.5mm x 13mm package, so the whole platform takes up 374.5 square millimetres. Samsung said ePoP decreases the total area used by approximately 40 percent.

“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” said Jeeho Baek, senior vice president of Memory Marketing at Samsung Electronics.

Baek said Samsung plans to expand its line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, with a focus on the high-end market.

However, a similar approach can be used in a wide range of mobile devices. Samsung already offers a single-package solution for wearables (like the Apple S1 module). The technology could also be used in tablets and other devices.

Images via Samsung Tomorrow blog

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