The best overclocker AM3, DDR3 chipset that should launch in Q4 2009 codenamed RD890 has a TDP of 18W. This is definitely not a small number as this chipset doesn’t have an IGP graphics core and simply takes care of PCIe 2.0 with Crossfire. AMD 790FX chipset for example has 13W TDP.

The new thing to come with RD890 is support for 6x1X Gen 2 and 1x4X PCIe port. The RD890 chip will use 29mm FCBGA package and it will interconnect with SB850 or cheaper SB810 Southbridge.

This new chipset is part of the Leo platform, and we expect to see it in early 2010, but as we already said, the RD890 based boards should be out in Q4 2009.