Published in
PC Hardware
11 December 2015
TSMC gets fan-out (InFO) wafer-level packaging
All ready for 2016
TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.
08 September 2011
Invensas unveils multi-die face-down packaging technology
And it is not going to take that lying down