Chipmaking gear maker ASML has told the world that that its customer TSMC has exposed more than 1000 wafers on an NXE:3300B EUV system in a single day.
Cannot fit more on 2.5D interposer
In early January we heard a thing or two about an AMD card codenamed Fiji, the one that comes with High Bandwidth Memory (HBM).
Overheating issue resolved, or so they say
Qualcomm and TSMC have reportedly worked out overheating issues on the Snapdragon 810.
By the end of March
It doesn’t come as a surprise that Nvidia is working on a new iteration of the Shield tablet.
Apple A9 or A10 we wonder
It looks like 2015 iPhones will be getting 14nm SoC chips manufactured by Samsung and GlobalFoundries.
First designs tape out in late 2015
Late Q2 or early Q3
Mobile still going strong
64-bit ARM of course
Qualcomm and AMD included