Coffee Lake might bring six cores to mainstream
Chinese tech site BenchLife.info has got its paws on some slides which show details of Intel's 9th generation Core processors.
Intel survey reveals 42 percent of consumers take proper security measures
Intel Security announced its second annual McAfee Most Hackable Holiday Gifts list which identifies the riskiest products on the market this Christmas.
Can’t have some working better than others
Apple has solved the performance gap between the Intel and Qualcomm modems on the iPhone 7 by disabling some of the Qualcomm X12 modem features so that it performs similarly to the Intel version.
CPUs and GPUs are on 14/16 nm
Keith Kressin, a Qualcomm senior vice president, product management, reminded us how the world changed in the last ten years and that the mobile industry leads the transition to smaller manufacturing nodess. With Snapdragon 835 being the first 10nm, the mobile SoC with Qualcomm on helm takes the lead beating CPU and GPU industry to a new manufacturing node.
World’s first 10nm SoC is a big deal
Kaby Lake, the third generation 14nm was launched in 2016 and it looks like Cannon Lake 10nm Intel CPU might only launch in late 2017. But it is fairly certain that the Snapdragon 835 mobile SoC is going to ship in the first half of 2017.
Automotive on the cusp of change
Intel CEO Brian Krzanich told the assorted throngs at the LA Auto Show's AutoMobility conference that Chipzilla will invest $250 million over the next two years to make fully autonomous driving a reality.
ROCm writes and compile parallel programs
AMD has released the latest version of its ROCm software tools which make it easier to write and compile parallel programs for its new Zen GPUs and CPUs.
One of the things that we are noticing is that all the leaks and other information coming out of Chipzilla, suggests that the outfit is getting excited about the overclocking market.
The Basin Falls platform with Skylake-X and Kaby Lake-X
The newest leaked documents reveal a few more details about Intel's next high-end desktop (HEDT) platform that will include both Kaby Lake-X and Skylake-X CPUs and be a part of the Basin Falls X-series platform.
AMD placing USB 3.1 chipset orders as well
According to sources from motherboard makers, Intel is planning to add USB 3.1 and Wi-Fi functionality to its upcoming 300-series motherboard series scheduled to be released at the end of 2017.