Helping out its contract chip makers
TSMC is thinking about dropping contract prices for its handset-IC clients to help ease the pressure of their declining ASPs and gross margins.
256GB/s with four 8Gb stacks, seven-fold increase over GDDR5
Roughly six months ago, AMD launched the first graphics cards packed with first-generation High Bandwidth Memory (HBM). Today, Samsung has just announced production of the industry’s first 20nm 4GB DRAM package based on second-generation High Bandwidth Memory 2 (HBM2).
Updatad: The next generation
Micron has promised to launch a new kind of memory that is twice the speed of mainstreams GDDR5 . This will be released during 2016 and will be company's answer to HBM.
Exclusive: Highest end are HBM 2.0, GDDR6, GDDR5X
AMD over-hyped the new High Bandwidth Memory standard and now the second generation HBM 2.0 is coming in 2016. However it looks like most of GPUs shipped in this year will still rely on the older GDDR5.
Snapdragon 820 might get an airing as burnt bridges are rebuilt
Samsung is considering usingg Qualcomm Snapdragon 820 chips for its Galaxy S7 range.
With six A72 and four A53 it looks great
The rumoured Helio X30 is real and if you thought that X20 was not enough to see off Snapdragon 820, it looks like the Helio X30 has a much better chance.
Four A72 cores and helio X22 too
If you thought the Helio X20 with ten core was the best MediaTek could offer, the company has now come up with an X30 which is a faster version of deca-core and has four A72 cores.
Promises an aggressive ramp-up
TSMC president and co-CEO Mark Liu has announced his outfit has begun volume shipment of chips based on its 16-nm FinFET manufacturing process.
Faster LTE at lower power 2MB RAM
Carrier aggregation was one of the buzzwords that Qualcomm tried to make significant in 2014, and especially in 2015.