AMD moving to GloFo's 12nm LP process in 2018.
Published in Processors


Papermaster makes it official

AMD’s CTO Mark Papermaster announced that the company will be moving “graphics and client products” from the Global Foundries14nm LP FinFET process  to the new 12nm LP process in 2018.

TSMC will make most of Qualcomm's power management ICs
Published in Processors


Goodbye Globalfoundaries 

TSMC is to make 70 to 80 percent of Qualcomm's new-generation power management ICs (PWM IC).

China upgrades its supercomputers
Published in Processors


ARMs up its Tianhe-1A CPU-GPU hybrid 

The National University of Defense Technology (NUDT) has, boosted the Tianhe-1A CPU-GPU hybrid that was deployed in 2010 with some nice new ARM processors and possibly some Matrix2000 DSP accelerators.

AMD explains dummy dies in Threadripper CPUs
Published in Processors


Dies are there but can't be enabled

There has been a lot of noise generated regarding the recent discovery that AMD Threadripper CPUs actually have four dies and not two dies and two "substrates" as it was originally believed but, according to AMD's James Prior, these are inactive dies and there is no way to enable them.

China could have an AI chip processing advantage
Published in Processors


Death of Moore’s Law opens new opportunities

The CEO of China-based Horizon Robotics, Yu Kai, claims that China could become very important in the development of AI chips.