Published in Memory

Western Digital releases 512 gigabit 64-layer 3D NAND chip

by on07 February 2017


Claims to be the first ever


Western Digital has lifted the kimono on the first-ever 512 gigabit 64-layer NAND chip claiming it is a stride forward in the new 3D NAND technology.

WD executive vice president of memory technology, Dr. Siva Sivaram, said the tech was doubling the density from its first 64-layer architecture in July 2016.

“This is a great addition to our rapidly broadening 3D NAND technology portfolio. It positions us well to continue addressing the increasing demand for storage due to rapid data growth across a wide range of customer retail, mobile and data centre applications," he said.

Western Digital developed the tech with its chum Toshiba, bringing out its first 64-layer 3D NAND technology in July 2016 and the world's first 48-layer 3D NAND technology in 2015.

It is not clear when the 512 gigabit 64-layer 3D NAND chip will show up in products. Western Digital will be discussing the breakthrough today at the International Solid State Circuits Conference (ISSCC) in San Francisco.

Last modified on 07 February 2017
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