Chinese foundries developing FinFET rival
Published in Processors

Slimming down with Ultra-Thin Body processes

Chinese foundries are ignoring FinFET technology and are developing Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production.

UMC expects wafer shipments fall
Published in News

Predicted slump

United Microelectronics (UMC) expects to post an up to 5 per cent decrease in wafer shipments for the third quarter of 2015. 

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Absolutely fabless
02 September 2010

Llano wafer pictured


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