TSMC gets fan-out (InFO) wafer-level packaging
Published in Processors


All ready for 2016

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.

TSMC wants 12 inch wafer factory in China
Published in Processors


16nm plans

TSMC has asked the Investment Commission of Taiwan's Ministry of Economic Affairs to allow it to invest in a wholly-owned 12-inch wafer manufacturing facility and a design service centre in Nanjing, China.

Chinese foundries developing FinFET rival
Published in Processors


Slimming down with Ultra-Thin Body processes

Chinese foundries are ignoring FinFET technology and are developing Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production.

UMC expects wafer shipments fall
Published in News


Predicted slump

United Microelectronics (UMC) expects to post an up to 5 per cent decrease in wafer shipments for the third quarter of 2015. 

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Lithography systems maker to advance chip making by two years

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Absolutely fabless
02 September 2010

Llano wafer pictured

fusion

GTC 2010: Quad-core Fusion closer than ever