Slimming down with Ultra-Thin Body processes
Chinese foundries are ignoring FinFET technology and are developing Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production.
United Microelectronics (UMC) expects to post an up to 5 per cent decrease in wafer shipments for the third quarter of 2015.
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