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Intel releases tiny 3G cell modem

Intel releases tiny 3G cell modem

Intel has released a 3G cellular modem with an integrated power amplifier that fits into a 300 mm2 footprint, claiming it…

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Braswell 14nm Atom slips to Q2 15

Braswell 14nm Atom slips to Q2 15

It's not all rosy in the house of Intel. It seems that upcoming Atom out-of-order cores might be giving this semiconductor…

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TSMC 16nm wafers coming in Q1 2015

TSMC 16nm wafers coming in Q1 2015

TSMC will start producing 16nm wafers in the first quarter of 2015. Sometime in the second quarter production should ramp up…

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Skylake-S LGA is 35W to 95W TDP part

Skylake-S LGA is 35W to 95W TDP part

Skylake-S is the ‘tock’ of the Haswell architecture and despite being delayed from the original plan, this desktop part is scheduled…

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Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

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New Lumia device coming?

Published in Mobiles

Industry first

Published in Mobiles

Others stuck below 5 percent

Published in Mobiles



Lumia might be a saviour after all

Published in Mobiles

Coming later this year

Published in Mobiles
Tuesday, 16 April 2013 13:28

More Nokia EOS smartphone rumors show up



Might end up with a quad-core Snapdragon 800

Published in Mobiles

nokia

MWC 2013: Finns roll out two mid range Lumias 

Published in Mobiles
Tuesday, 12 February 2013 14:59

Nokia announces new Asha 310



Affordable 3-incher with dual SIM and WiFi

Published in Mobiles
Wednesday, 30 January 2013 15:09

Nokia schedules its MWC event for February 25th

nokia

Rumors point to new Lumia lineup

Published in Mobiles

nokia

Nokia looks to brighter future

Published in Mobiles
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