Recovering from a list of multi-billion dollar writedowns
According to a recent Chinese-language report, TSMC and Foxconn Electronics are partnering up to place bids for shares of Toshiba’s memory business after the company dealt with a major loss in its devices and components business last year amid a drop in global memory prices. And problems with nuclear matters.
On track for the first half of the year
Although it is still a long way off into the future, TSMC said that it is on track to start risk production of 5nm chips in the first half of 2019.
Key customers were not interested
MediaTek is planning a Helio X30 in 10nm later this year but news from Taiwan indicates that some key customers didn’t order the new flagship 10 core chip.
It is between 13 and 11nm dummies
A while ago the dark satanic rumour mill suggested that Taiwan Semiconductor Manufacturing Company was planning to release a sexed-up version of its 16nm manufacturing technology dubbed "12nm".
60 percent of revenues to come from US this year
Taiwan Semiconductor Manufacturing Company held its most recent investors conference on January 12th, during which company officials said that it has not ruled out the possibility of building a facility in the US as a response to recent nationalistic pleas to restore American manufacturing jobs.
TSMC needs to improve yield rates on 10nm first
The folks at Boston-based BlueFin Research Partners have recently given some much-needed commentary on the state of 10nm chip production at TSMC for Apple’s next-generation iPhone units.
It’s the thin edge of the wedge
Prices of 12-inch silicon wafers may rise by as much as 20 percent in 2017.
From the house of TSMC in 2017
The Kirin 960 is a 16nm SoC, that powered the Huawei Mate 9 and Mate 9 Pro, and is quite powerful, but it seems that Huawei plans a Kirin 970 SoC made using the 10nm FinFET manufacturing process and with obviously faster performance at lower energy consumption.
A smaller version of existing 16nm technology
According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes that have been adopted over the past few years.