Up to 16 cores/32 threads with new HEDT platform
During its 2017 Financial Analyst Day, AMD has officially announced its new HEDT platform and Ryzen Threadripper. This CPU will "go beyond Ryzen 7" and target the world's fastest ultra-premium desktop systems.
End of June
According to the latest set of rumors, Intel might be scrambling to launch its X299 platform with Skylake-X and Kaby Lake-X CPU and these could come as early as late June/beginning of July.
Running on Intel X299 chipset
We already knew that Intel is planning to launch two CPU architectures for its new HEDT platform, the Kaby Lake-X and Skylake-X, both which will use the same X299 chipset, and today we have a few more details about the quad-core Core i7-7740K Kaby Lake-X SKU, spotted in SiSoft database.
Coming in August
According to the latest leak, we now have more information regarding the first batch of Intel's Skylake-X and Kaby Lake-X CPUs that will be launching sometime in August, together with the new X299 chipset.
The Basin Falls platform with Skylake-X and Kaby Lake-X
The newest leaked documents reveal a few more details about Intel's next high-end desktop (HEDT) platform that will include both Kaby Lake-X and Skylake-X CPUs and be a part of the Basin Falls X-series platform.
AMD prepares for IPC race with Intel
In May 2015, we reported that AMD’s first Zen CPUs, launching in Q4 2016, would most likely be quad-core chips based on a presentation slide showing the company’s Zen core units scaling up to four cores with shared L3 cache. According to new information released one year later, this may not be the case and, the company could be preparing to launch eight and six-core variants in a tight efficiency race against Intel's 'Kaby Lake' CPUs.
Compared with the Core i7-5960X
It is obvious that Intel's Broadwell-E HEDT launch is drawing near as with all the previous leaks we now have some of the first benchmarks of the flagship ten-core Core i7-6950X.
Up to 20MB cache, overclockable K an X SKUs
Intel plans to launch an update to the Haswell-E high-end line of processors and it calls them Broadwell-E.
Uses soldered thermal interface material
All three SKUs listed