Look out Samsung
Chipzilla has seen how NAND flash storage rising and memory makers are speeding up 3D NAND flash product development and thought “I’ll be ‘aving some of that”.
Based on TLC 3D NAND
According to the latest leaked slide, Intel is working on the new performance-segment 610P series SSD based on TLC 3D NAND, M.2 2280 form-factor and PCIe NVMe interface.
Ready for next year
The Chinese will be switching on their first 12-inch fab and churning out NAND flash and DRAM memory at the end of 2016.
Six new flavours with IMFT 3D NAND
Intel is refreshing its consumer, data centre and IoT SSDs with six SSDs with its new IMFT 3D NAND under the bonnet.
Chip making could be picking up
There are signs that chip making might be starting to pick up after one of the largest supplier of tools used to make semiconductors turned in a bigger than expected profit.
Smaller layered chips
Semiconductor maker Micron said it has introduced its first 3D NAND memory for mobile devices and products based on Universal Flash Storage (UFS) 2.1.
Coming in PCIe/NVMEe, SATA and M.2 and 2.5-inch form-factors
Micron has announced its first client- and OEM-oriented solid-state drives based on 3D NAND, the Micron 1100 and Micron 2100 series.
3D NAND on board
Chipzilla has released its super-fast and high-capacity SSDs with 3D NAND chips.
Toshiba and SanDisk start sampling 48-layer 128Gb chips
Micron and Intel have announced the availability of 256Gb NAND, the world’s highest density flash memory, but Toshiba is hot on their heels.