TSMC to drop 16nm and 20nm pricing
Published in Processors


Helping out its contract chip makers

TSMC is thinking about dropping contract prices for its handset-IC clients to help ease the pressure of their declining ASPs and gross margins.

Samsung begins 20nm High Bandwidth Memory 2 production
Published in News


256GB/s with four 8Gb stacks, seven-fold increase over GDDR5

Roughly six months ago, AMD launched the first graphics cards packed with first-generation High Bandwidth Memory (HBM). Today, Samsung has just announced production of the industry’s first 20nm 4GB DRAM package based on second-generation High Bandwidth Memory 2 (HBM2).

Micron offers 2X GDDR5 Speed in 2016
Published in Graphics


Updatad: The next generation

Micron has promised to launch a new kind of memory that is twice the speed of mainstreams GDDR5 . This will be released during 2016 and will be company's answer to HBM.

GDDR5, GDDR6 rule 2016 GPUs
Published in Graphics


Exclusive: Highest end are HBM 2.0, GDDR6, GDDR5X

AMD over-hyped the new  High Bandwidth Memory standard and now the second generation HBM 2.0 is coming in 2016. However it looks like most of GPUs shipped in this year will still rely on the older GDDR5.

Samsung mulls Qualcomm in Galaxy S7
Published in Processors


Snapdragon 820 might get an airing as burnt bridges are rebuilt

Samsung is considering usingg Qualcomm Snapdragon 820 chips for its Galaxy S7 range.

MediaTek Helio X30 is real
Published in Processors


With six A72 and four A53 it looks great 

The rumoured Helio X30 is real and if you thought that X20 was not enough to see off Snapdragon 820, it looks like the Helio X30 has a much better chance.

MediaTek announces X30 faster deca-core
Published in Processors


Four A72 cores and helio X22 too

If you thought the Helio X20 with ten core was the best MediaTek could offer, the company has now come up with an X30 which is a faster version of deca-core and has four A72 cores.

TSMC moves to 16nm FinFET
Published in Processors


Promises an aggressive ramp-up

TSMC president and co-CEO Mark Liu has announced his outfit has begun volume shipment of chips based on its 16-nm FinFET manufacturing process.

iPhone 6S new 12 MP camera and Qualcomm Cat 6 LTE
Published in Mobiles


Faster LTE at lower power 2MB RAM

Carrier aggregation was one of the buzzwords that Qualcomm tried to make significant in 2014, and especially in 2015. 

GloFlo had a 20nm node working
Published in Processors


So why did AMD pull Skybridge?

Yesterday we wrote an article about how GloFlo might have had a hand in cancelling AMD's  Skybridge project.