has said that it is expanding its existing and new fabs using 12-inch technology in a bid to kick rival TSMC in the knackers. Speaking to Techeye
GloFo's Mojy Chian said the outfit's new fabs in New York State, in Singapore and Fab 1 in Dresden will all ramp up processing of wafers.
He said that Singapore will pump out 50,000 wafers and a month and Dresden 60,000 wafers a month and there will be further capacity expansion in the next few weeks.
The numbers compared to TSMC will be very competitive. Chian said that while it had no immediate plans make 450 millimetre wafers creating extra capacity on 12-inch wafers will be good enough.
Abu Dhabi could well be a candidate for a future fab. Sources told TechEye that AMD will lessen its share in Globalfoundries as the year wears on.