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3rd-gen iPhone's hardware suppliers get named


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TSMC and subsidiaries to benefit


According to industry sources in Taiwan playing roles in Apple's latest upcoming crown jewel, the device is definitely on track to be launched by mid-2009 with the first batch estimated to be around five million units.

Assembly suppliers will begin hardware shipments for the 3rd-generation iPhone starting from May, the sources said. As of recent, we have begun to see a trickle hardware supplier information for the new device floating around the net. Thanks to the guys at Digitimes, we may have a complete list here:

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On another note, TSMC and two of its subsidiaries are likely to benefit from their roles in the manufacturing of the next-generation iPhone. According to Taiwanese sources, TSMC itself has likely landed itself a sizable chunk of change with foundry orders for Bluetooth integrated circuits, GSM EDGE power amplifiers, and the 3.2 megapixel OmniVision CMOS image sensor. The sensor will undergo wafer-level chip-scale packaging and testing from Xintec Inc. while VisEra will manufacture its on-chip color filters.

All in all, we can positively withhold the idea that a next-generation iPhone is real and is currently in the making.

More here.

Last modified on 14 April 2009
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