Featured Articles

AMD sheds light on stacked DRAM APUs

AMD sheds light on stacked DRAM APUs

AMD is fast tracking stacked DRAM deployment and a new presentation leaked by the company  points to APUs with stacked DRAM,…

More...
Nvidia officially launches the 8-inch Shield Tablet

Nvidia officially launches the 8-inch Shield Tablet

As expected and reported earlier, Nvidia has now officially announced its newest Shield device, the new 8-inch Shield Tablet. While the…

More...
Intel launches new mobile Haswell and Bay Trail parts

Intel launches new mobile Haswell and Bay Trail parts

Intel has introduced seven new Haswell mobile parts and four Bay Trail SoC chips, but most of them are merely clock…

More...
Aerocool Dead Silence reviewed

Aerocool Dead Silence reviewed

Aerocool is well known for its gamer cases with aggressive styling. However, the Dead Silence chassis offers consumers a new choice,…

More...
AMD A8-7600 Kaveri APU reviewed

AMD A8-7600 Kaveri APU reviewed

Today we'll take a closer look at AMD's A8-7600 APU Kaveri APU, more specifically we'll examine the GPU performance you can…

More...
Frontpage Slideshow | Copyright © 2006-2010 orks, a business unit of Nuevvo Webware Ltd.
Thursday, 14 August 2008 06:48

SuperSpeed USB to demo at IDF next week

Written by David Stellmack

Image

The xHCI USB 3.0 specification to get public outing



While some companies are a bit unhappy about it as they claim that Intel is withholding information, it appears that Intel will be showing the new Extensible Host Controller Interface that is known as xHCI for short in the revision 0.9 spec next week at IDF.

The new USB 3.0 standard, which is expected to be adopted by the industry, is also known by its sexy name as SuperSpeed USB. According to report,s a good look should come next week at the technology during the Intel Developers Forum in San Francisco next week.

Unrest over the possibility that Intel is or was withholding information about the xHCI and USB 3.0 to give themselves an advantage over other hardware and software providers seems to be groundless, as according to the last news that we have, the specification and USB 3.0 software stack will be provided and made available under a royalty-free arrangement from the USB 3.0 Promoter Group, provided that they sign the xHCI contributor agreement.

The big news of USB 3.0 is that it is able to deliver 10 times the bandwidth that is available with the current USB 2.0 specifications. USB 3.0 will be able to deliver a staggering 600 MB/s which are necessary for the high bandwidth future devices.

AMD appears to be supporting the new USB 3.0 specification, which is believed to be somewhat necessary in order for the specification to catch on and be successful. AMD appears to have signed on in the belief that the support for USB 3.0 is necessary, coupled with the company’s continued support of open source standards.

Rumors continue to come our way suggesting that Nvidia has also signed the USB 3.0 agreement and is looking to support it, as well. Right now we can’t exactly confirm this, but we suspect that it is true and Nvidia would not want to be the only chipset not supporting the USB 3.0 standards.

While USB 3.0 is just starting to get going, the IEEE has recently approved the 1394-2008 standard, which will jump the speed up to a max of 3.2 GB/s using the same cables and connectors as the current 1394b standard. Reports indicate that the 1394 camp looks to bump the speed up to 6.4 GB/s using the same technology before it is all said and done.

Last modified on Friday, 15 August 2008 04:06

David Stellmack

E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
blog comments powered by Disqus

 

Facebook activity

Latest Commented Articles

Recent Comments