Fujitsu America is releasing the company's first mobile silicon on chip WiMax product in August.
According to a press release the baseband product, the MB86K21 802.16e, is designed to show significant performance improvements.
The new device is based around the WiMax Forum Wave 2 mobile device certification. It supports 5 and 10 MHz channel bandwidths, has a variety of adaptive modulations modes and has security support built in. The MB86K21 802.16e will support USB 2.0 and Card Bus / PCI host interface support.
The Chip will be released in Asia first. A Design Kit and a PC Card Reference Platform Delivery Kit will be released soon.