Although the new dual-GPU Hawaii-based AMD Radeon R9 295X2 graphics card is scheduled to oficially launch on April 8th, the full press deck which includes all the key specifications, cooler details as well as general performance has been leaked online.
While it was already pretty much confirmed that the Radeon R9 295X2, codename Vesuvius, will feature two fully enabled 28nm Hawaii GPUs with 2816 Stream Processors, 176 TMUs, 64 ROPs and a full 512-bit wide memory interface, we did not have any precise details regarding clocks of those GPUs, at least not until today. In case you missed it earlier, the two GPUs are interconnected via a PLX PEX8747 PCI-Express 3.0 x48 bridge chip and feature a total of 8GB of GDDR5 memory (4GB per GPU) and a hybrid liquid+air dual-slot cooler.
The GPUs on the Radeon R9 295X2 are clocked at up to 1018MHz, according to leaked slides, while 8GB of GDDR5 memory ended up clocked at 5.0GHz. The PCB below the cooler is apparently based on a 12-phase VRM design and needs two 8-pin PCI-Express power connectors. The specified TDP is set at 500W which means that AMD is pushing those two 8-pin PCI-Express above their 150W rating, which also means that these graphics cards will need a hefty and quality PSU with a powerful +12V rail in order to work properly.
The hybrid liquid+air cooler is co-developed by AMD and Asetek and features pump-blocks located on the GPUS and connected to a 120mm radiator. The center placed fan on the graphics card should keep the VRM, memory and PCIe bridge chip well cooled.
According to one of the slides, the Radeon R9 295X2 should be around 60 percent faster than the Radeon R9 290X in 3DMark Firestrike benchmark, which is in line with the expectations.
You can check out the rest of the slides over at Videocardz.com.